In a latest patent we have found that Nikon is working to heat management system inside DSLR cameras, latest generation of camera sensor produce a lot of heat due to continuous 4K video recording. And that’s why probably they are working on new sensor heatsink units to enhance the performance of the upcoming DSLRs camera.
Nikon Patent DSLR with Sensor Heat Sink Unit Patent Details (Translated )
There has been a problem that heat generated by the imaging chip can not be efficiently dissipated from the imaging chip to the outside. There is known a camera module in which a solid-state imaging device is die-bonded to the bottom surface of a ceramic package, and the upper end surface of the ceramic package is bonded to a printed circuit board.
Translated from Japanese language
As the mounting substrate 2110, the same configuration as the mounting substrate 120 and the electronic component mounting substrate 130 or the same configuration as the mounting substrate 1320 can be applied. Similar to the mounting substrate 120 described with reference to FIG. 10 and the mounting substrate 1320 described with reference to FIG. 9 and the like, the mounting substrate 2110 is formed of a solder resist layer 2610 for mounting the imaging chip 100 and a solder resist layer 2610 And at least the wiring layer 2620.
Canon isn’t behind they are working on DSLR heat sink unit
Also see – Nikon Upcoming Mirrorless and DSLRs 2019 – 2020
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It physically hurts my eye cells to look at those watermarked patent diagrams..
If I don’t do that next day other websites will copy and paste without putting any reference.