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Firmware Update

Canon M6 Mark III or Canon M7 with External Heat Sink Unit ?

Canon’s Latest Patent shows an external Heat sink unit for dissipation of internal heat. Canon working on an advanced external heat sink for their upcoming APS-C Mirrorless cameras.  As Canon will update the Video performance of the APS-C line-up, sure they will have to manage heat. In a recent patent, we have spotted a Canon EOS M6 style camera attached to an external heat sink unit.

Canon M6 Mark III or Canon M7 or any other model?

We don’t know at the moment which high-end model Canon will select for the introduction of external heat-sink units. But, for sure they are working on High-End Mirrorless camera advanced video core specification, Oversampled 4k or 6k files do generate a lot of heat, and to manage that in smaller bodies they have found a nice hack.

As you can see in the patent drawing vert clearly the design of the Canon external heat sink unit on the right side of the camera. here are some details straight coming out from the patent document

Canon Patent Document Details

Patent Abstract

An electronic device includes an interface unit including a connection portion attachable to an external device by being connected with an interface terminal disposed in the external device, a heat transfer unit, and a heat dissipation unit, wherein the heat transfer unit and the heat dissipation unit are connected with the interface unit, and are in a direction opposite the external device when the interface unit is connected with the external device.

Fron the patent

In Japanese Patent Application Laid-Open. the ventilation duct is formed in an image capturing device, and the ventilation duct is disposed of in such a manner that the ventilation duct passes near the heat generation bodies, such as an image sensor. The heat dissipation device equipped with a heat dissipation fan is attached to the image capturing device. Consequently, an air discharge opening in the image capturing device and an air intake opening of the heat dissipation device are attached to be opposite each other. In the image capturing device discussed in the Japanese Patent Application, the heat dissipation fan is operated to suck outside air from the air intake opening of the image capturing device and discharge the outside air that has passed near the heat generation bodies and has been warmed from the air discharge opening of the heat dissipation device.

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