As we can see the beautiful internal framework of upcoming Leica T Type 701 camera, the body Chassis is made up of magnesium alloy, the hole thing will be protected from the environment by adding rubber seals.
The Camera is Rumored to be announced on April 24th, 2014, the upcoming mirrorless camera will feature APS-C sensor and Touchscreen LCD with Built-in WiFi.
see leaked specification and image here and images here, more Chassis Image after the break
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leaked via – leicarumors
