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Firmware Update

Sony Curved Sensor Patent

we have already seen the leaked image of Sony curved sensor and not only that we have also published the first image captured from the curved sensor few days ago, now the Japanese patent hunting blog egami just surfaced out the patent details that shows the Sony already patented all the possible methods to create curved sensor, take a look below.

pressurization pressing-force-and-magnetic

sony-curved-sensor-decompre

Description and self-interpretation of the patent literature (translated via google)

  • Patent Publication No. 2014-116380
    • Publication date 2014.6.26
    • Filing date 2012.12.7
  • Sony patents
    • Board of thermoplastic material
      • Decompression
      • Pressing force
      • Pressurization
    • Board of magnetic material
      • Magnetic field

1 comment to Sony Curved Sensor Patent

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