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Firmware Update

Sony A7 IV to Feature A7S III Heat Sink Unit and More...

According to the latest rumors coming out from the rumor mills, Sony A7 IV Camera features the same body design as we have seen in the Sony A7S III Camera. The camera is also said to feature the same body design as well as heat sink unit as we have seen in the Sony A7s III camera.

Sony A7 IV Updated Rumored Specification
launch in October (if chip supply permits this)
Newly developed 33MP sensor
4k30 video is oversampled from 7K
5.5 stops of IBIS (+ AS)
Same A7sIII body design
Full size HDMi
UHS-II SD-cards and CF Xpress cards

Keep in mind the rumored specification and the announcement date aren’t coming out from trusted sources . So, as we say take it with a grain of salt. We will post more updates as soon as more details become available to us.

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